Method of manufacturing multi-layered printed circuit board

• Main Authors: KIM GEUN HO, YANG DEK GIN, CHOI SEONG WOO, CHUNG CHAN YEUP
• Format: Patent
• Language: English
• Published: 04.09.2008
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

The present invention relates to a method of manufacturing a multi-layered printed circuit board which can decrease the cost and time required to produce the printed circuit board and can improve heat radiation characteristics and bending strength.