METHOD OF INSPECTING AN IDENTIFICATION MARK, METHOD OF INSPECTING A WAFER USING THE SAME, AND APPARATUS FOR PERFORMING THE METHOD

In a method of inspecting an identification mark, an image of the identification mark on a semiconductor wafer is obtained. The identification mark may be identified using the identification mark image. A region where the identification mark is formed may be inspected using the identification mark i...

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Bibliographic Details
Main Authors LEE KYU, PARK JE-KWON, KIM HYUN-HEE, KO JAE-KYUN, LIM YOUNG-KYU
Format Patent
LanguageEnglish
Published 28.08.2008
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Summary:In a method of inspecting an identification mark, an image of the identification mark on a semiconductor wafer is obtained. The identification mark may be identified using the identification mark image. A region where the identification mark is formed may be inspected using the identification mark image after the identification mark is identified.
Bibliography:Application Number: US20080037794