SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, SEMICONDUCTOR CHIP MOUNTING BODY, SEMICONDUCTOR CHIP STACKED MODULE, AND SEMICONDUCTOR CHIP MOUNTING SUBSTRATE MANUFACTURING METHOD

• Main Authors: NAKAHASHI AKIHISA, MAEGAWA YUKIHIRO, SUZUKI NAOKI
• Format: Patent
• Language: English
• Published: 21.08.2008
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a connection region for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks for alignment at the time of stackin...