ENCAPSULATED CHIP SCALE PACKAGE HAVING FLIP-CHIP ON LEAD FRAME STRUCTURE AND METHOD

• Main Authors: FAUTY JOSEPH K, THIENPONT DENISE, LETTERMAN JAMES P
• Format: Patent
• Language: English
• Published: 21.08.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In one embodiment, an encapsulated electronic package includes a semiconductor chip having patterned solderable pads formed on a major surface. During an assembly process, the patterned solderable pads are directly affixed to conductive leads. The assembly is encapsulated using, for example, a MAP o...