Circuitized substrate with p-aramid dielectric layers and method of making same
A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
14.08.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided. |
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Bibliography: | Application Number: US20080081051 |