MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING STI TECHNIQUE

A first trench and a second trench having width wider than the first trench are simultaneously formed in a main surface area of a semiconductor substrate. The width of an opening portion of the first trench is made narrower by forming a first insulating film on the main surface of the semiconductor...

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Bibliographic Details
Main Author KIYOTOSHI MASAHIRO
Format Patent
LanguageEnglish
Published 31.07.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A first trench and a second trench having width wider than the first trench are simultaneously formed in a main surface area of a semiconductor substrate. The width of an opening portion of the first trench is made narrower by forming a first insulating film on the main surface of the semiconductor substrate and in the first and second trenches. A second insulating film is formed on the first insulating film by use of a high-density plasma-CVD method to form a void in the first trench while covering the opening portion of the first trench, and the second trench is filled with the second insulating film. Then, part of the second insulating film which covers the opening portion is removed by anisotropic etching and the void is filled with an insulating film having fluidity at the film formation time.
Bibliography:Application Number: US20070874292