Method of Forming Component Package

There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mold cavity after forming the isol...

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Bibliographic Details
Main Authors JOB DORAISAMY STANLEY, TONG SOON HOCK, YONG WAE CHET
Format Patent
LanguageEnglish
Published 03.07.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mold cavity after forming the isolation layer on the rear of the die pad or heat sink.
Bibliography:Application Number: US20080049276