MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH ADHESIVE SPACING STRUCTURES

A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer...

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Bibliographic Details
Main Authors HA JONG-WOO, LEE SEONGMIN, BAE JOHYUN
Format Patent
LanguageEnglish
Published 03.07.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer, and forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer.
Bibliography:Application Number: US20060617413