INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION TECHNOLOGY

An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support struc...

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Bibliographic Details
Main Authors SONG SUNGMIN, JANG KI YOUN, BAE JOHYUN
Format Patent
LanguageEnglish
Published 26.06.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit package system that includes: providing a support structure including an integrated circuit and an electrical contact adjacent thereto; providing a first mold having a first cavity with a projection and a recess for collecting flash; engaging the first mold on the support structure with the first cavity over at least a portion of the integrated circuit and the projection and the recess between the at least a portion of the integrated circuit and the electrical contact; and injecting encapsulation material into the first cavity.
Bibliography:Application Number: US20060615919