ELECTRONIC DEVICE AND DECOMPOSING METHOD OF ELECTRONIC DEVICE

• Main Authors: DATE HIROAKI, EBISU KATSUJI, KUTAMI MICHINORI, SUZUKI SHIGEHARU
• Format: Patent
• Language: English
• Published: 19.06.2008
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMBINED OPERATIONS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DISPOSAL OF SOLID WASTE; DYES; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; OTHER WORKING OF METAL; PAINTS; PERFORMING OPERATIONS; POLISHES; RECLAMATION OF CONTAMINED SOIL SOIL; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; UNIVERSAL MACHINE TOOLS; USE OF MATERIALS AS ADHESIVES

A bonding agent and an adhesive sheet for strongly bonding a plurality of components constituting the electronic device for the lifetime of the device, and for lowering a bonding force thereof for easily separating these components on the occasion of decomposing the electronic device. According to the present invention, a plurality of components can be easily decomposed only by executing a heat treatment through bonding of a plurality of components with a bonding agent including a thermo-melting microcapsules which includes a mold releasing agent.