Circuit Board Including Stubless Signal Paths and Method of Making Same
A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
29.05.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment. |
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Bibliography: | Application Number: US20060557709 |