Polyketone Fiber Paper, Polyketone Fiber Paper Core Material For Printed Wiring Board, And Printed Wiring Board

• Main Authors: HIGUCHI MASAO, SHIRATORI NAOYUKI, MATSUSHITA FUMIO
• Format: Patent
• Language: English
• Published: 08.05.2008
• Subjects: IMPREGNATING OR COATING OF PAPER; PAPER NOT OTHERWISE PROVIDED FOR; PAPER-MAKING; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; PRODUCTION OF CELLULOSE; PULP COMPOSITIONS; TEXTILES; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G

An aliphatic polyketone fiber paper comprising aliphatic polyketone fibers and a polyketone fiber paper core material for a printed wiring board are provided. The polyketone fiber paper and the core material have high strength and modulus of elasticity; excellent dimensional stability, chemical resistance, heat resistance, adhesiveness and electrical insulation; and low dielectricity and water absorbance, and are thin, porous, and uniform. A printed wiring board prepared from the core material having a low dielectric constant, dimensional stability, electrical insulation, and properties of being uniformly bored by laser punching is also provided. The aliphatic polyketone fiber paper and the core material for a printed wiring board comprises 1 to 100% by mass of aliphatic polyketone fibers which comprise the repeating unit of the below-mentioned formula (1), the fibers having an average fiber length of 0.5 to 10 mm, an average fiber diameter of 0.1 to 20 mum, a thickness of 5 to 200 mum, a void ratio of 30 to 90%, and a strength per unit mass of 100 MN/kg or more. Also provided is a single layer or multilayer printed wiring board which comprises a core material impregnated or coated with a polymer resin, a low dielectric polymer resin, or a polyphenylene ether-based epoxy resin. -CH2-CH2-CO- (1)