Managing forces of semiconductor device layers

Embodiments of semiconductor devices and methods of making such devices are presented herein.

Saved in:
Bibliographic Details
Main Authors LEE KEVIN J, KANDAS ANGELO, GROVER ROHIT, BRANDERHORST EVERETT, JOSHI SUBHASH, HUANG TZUEN-LUH
Format Patent
LanguageEnglish
Published 03.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Embodiments of semiconductor devices and methods of making such devices are presented herein.
Bibliography:Application Number: US20060540200