Method of manufacturing light emitting diode package and white light source module

A method of manufacturing a light emitting diode package, the method including: forming a resin mold encapsulating a light emitting diode chip; and forming a phosphor thin film on a surface of the resin mold by applying a phosphor-containing coating material on the surface of the resin mold.

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Bibliographic Details
Main Authors KIM HYUNG SUK, HAHM HUN JOO, PARK YOUNG SAM
Format Patent
LanguageEnglish
Published 27.03.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of manufacturing a light emitting diode package, the method including: forming a resin mold encapsulating a light emitting diode chip; and forming a phosphor thin film on a surface of the resin mold by applying a phosphor-containing coating material on the surface of the resin mold.
Bibliography:Application Number: US20070902233