SEMICONDUCTOR WAFER FRONT SIDE PROTECTION

• Main Authors: KRYWANCZYK TIMOTHY C, ABRAMS ALLAN D, BROUILLETTE DONALD W, DANAHER JOSEPH D, STONE IVAN J, WHALEN MATTHEW R, LAMOTHE RENE A
• Format: Patent
• Language: English
• Published: 13.03.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

There is provided a method for making a wafer comprising the steps of providing a substrate having a first surface, an opposite second surface, and at least one side edge defining a thickness of the substrate, the at least one side edge having a first peripheral region and a second peripheral region...