ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ON A WORKPIECE WITH THROUGH HOLES DURING PLATING
A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal d...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.02.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A method and apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes. |
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Bibliography: | Application Number: US20070836903 |