WAFER POLISHING HEAD
A wafer polishing head according to the invention is disclosed. In the wafer polishing head, an automatic control device is additionally installed outside the wafer polishing head for automatically adjusting a pressure applied on a retaining ring. This ensures the bottom of the retaining ring always...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
27.12.2007
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Subjects | |
Online Access | Get full text |
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Summary: | A wafer polishing head according to the invention is disclosed. In the wafer polishing head, an automatic control device is additionally installed outside the wafer polishing head for automatically adjusting a pressure applied on a retaining ring. This ensures the bottom of the retaining ring always lower than that of a carrier, thereby preventing a semiconductor wafer from slip during polishing. Furthermore, a liquid pressure generated to press the carrier can efficiently alleviate wabble during polishing. Therefore, the wafer polishing head of the invention can greatly improve a polishing uniformity. |
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Bibliography: | Application Number: US20070850453 |