BONDED CHIP ASSEMBLY WITH A MICRO-MOVER FOR MICROELECTROMECHANICAL SYSTEMS

An embodiment of a micro-mover in accordance with the present invention can include a movable plate hermetically sealed between a top cap wafer and a bottom cap wafer. A magnet disposed on one or both of the cap wafers. The movable plate can include current paths disposed within a magnetic field gen...

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Bibliographic Details
Main Authors ASCANIO PETER DAVID, BELOV NICKOLAI, ADAMS DONALD EDWARD
Format Patent
LanguageEnglish
Published 20.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An embodiment of a micro-mover in accordance with the present invention can include a movable plate hermetically sealed between a top cap wafer and a bottom cap wafer. A magnet disposed on one or both of the cap wafers. The movable plate can include current paths disposed within a magnetic field generated by the magnet, and coaxially with a surface of the movable plate. When current is applied to the current paths, the movable plate is urged some distance within a gap between the movable plate and a stationary portion disposed co-planar with the movable plate.
Bibliography:Application Number: US20060553421