Method of forming semiconductor packaged device

A method of forming a semiconductor packaged device ( 10 ) including die bonding a flip chip die ( 12 ) to a first surface ( 14 ) of a lead frame ( 28 ). A lid ( 34 ) is attached to a top surface ( 36 ) of the flip chip die ( 12 ). A wire bond die ( 40 ) is attached to a second surface ( 22 ) of the...

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Bibliographic Details
Main Author LO WAI YEW
Format Patent
LanguageEnglish
Published 06.12.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of forming a semiconductor packaged device ( 10 ) including die bonding a flip chip die ( 12 ) to a first surface ( 14 ) of a lead frame ( 28 ). A lid ( 34 ) is attached to a top surface ( 36 ) of the flip chip die ( 12 ). A wire bond die ( 40 ) is attached to a second surface ( 22 ) of the lead frame ( 28 ) and electrically connected to the lead frame ( 28 ) with wires ( 44 ). A mold compound then is formed over the flip chip die ( 12 ), the wire bond die ( 40 ) and the lead frame ( 28 ).
Bibliography:Application Number: US20060444448