Semiconductor device

A semiconductor device comprising, a layer on which a semiconductor element is arranged, an insulation layer on which a wiring connected to the semiconductor element is arranged, dummy metal plates arranged in the insulation layer, wherein the dummy metal plates have an aspect ratio larger than 1, a...

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Bibliographic Details
Main Author IKUTA HIROKO
Format Patent
LanguageEnglish
Published 29.11.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device comprising, a layer on which a semiconductor element is arranged, an insulation layer on which a wiring connected to the semiconductor element is arranged, dummy metal plates arranged in the insulation layer, wherein the dummy metal plates have an aspect ratio larger than 1, and are arranged substantially perpendicularly to the wiring.
Bibliography:Application Number: US20070806843