Methods for Fabricating Three-Dimensional All Organic Interconnect Structures

The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus laye...

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Bibliographic Details
Main Authors SUNDARAM VENKATESH, DALMIA SIDHARTH, SWAMINATHAN MADHAVAN, WHITE GEORGE E
Format Patent
LanguageEnglish
Published 22.11.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MAGNETS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
TRANSPORTING
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Summary:The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus layer to form z-axis conductive stud within the high and low temperature LCP. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond.
Bibliography:Application Number: US20070833626