Apparatus for processing a semiconductor wafer and method of forming the same

A semiconductor wafer processing apparatus may include a chuck and/or a focus ring. The chuck may be configured to hold a wafer. The focus ring may be disposed surrounding a rim of the chuck. The focus ring may include a first section formed of a first material and a second section formed of a secon...

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Bibliographic Details
Main Authors KIM KIUL, SHIN HONG-JAE, LEE NAE-IN
Format Patent
LanguageEnglish
Published 08.11.2007
Subjects
ACCESSORIES THEREFOR
APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES
APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
PHOTOGRAPHY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A semiconductor wafer processing apparatus may include a chuck and/or a focus ring. The chuck may be configured to hold a wafer. The focus ring may be disposed surrounding a rim of the chuck. The focus ring may include a first section formed of a first material and a second section formed of a second material. The first material and the second material may have different conductivities. A method of forming a semiconductor wafer processing apparatus may include forming a first section of a focus ring from a first material, forming a second section of the focus ring from a second material having a different conductivity than the first material, combining the first and second sections to form a focus ring, and/or arranging the focus ring so as to surround a chuck.
Bibliography:Application Number: US20070790175