Dual cure resin composite system and method of manufacturing the same

• Main Authors: YANG WENLIANG P, LIN WENDY W
• Format: Patent
• Language: English
• Published: 18.10.2007
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

A system including a dual cure composite structure is disclosed. The system also includes a first layer comprising a resin having a first and a second functional group. The system further includes a second layer comprising the resin having the first and the second functional group. The system also includes a third layer comprising the resin having the first and the second functional group. The system further includes a first covalent bond across an interface of the first and the second layer and a second covalent bond across another interface of the second and the third layer. The system further includes more than two layers comprising the resin having the first and second functional group. A method of manufacturing a system including a dual cure composite structure is also disclosed. The method includes providing a first layer comprising a resin having a first functional group and a second functional group. The method also includes applying a first curing source to partially cure the first layer. The method further includes providing a second layer comprising the resin having the first and the second functional group onto the first layer and applying a second curing source to fully cure the first layer and partially cure the second layer simultaneously.