Touch panel fabrication method

A touch panel fabrication method includes the steps of (a) preparing a first substrate and a second substrate, (b) disposing a seal frame having an opening on the first substrate, (c) coupling the first substrate and the second substrate together by the seal frame such that a vacancy is defined by t...

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Bibliographic Details
Main Authors WANG WEN-TSUNG, HWANG CHIN-PEI, WANG CHUN-HAO, CHU SUNG-HAO
Format Patent
LanguageEnglish
Published 11.10.2007
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A touch panel fabrication method includes the steps of (a) preparing a first substrate and a second substrate, (b) disposing a seal frame having an opening on the first substrate, (c) coupling the first substrate and the second substrate together by the seal frame such that a vacancy is defined by the first substrate, the second substrate and the seal frame, and (d) filling up the vacancy with a dielectric material through the opening of the seal frame.
Bibliography:Application Number: US20060392590