Method of forming a chemical mechanical polishing pad utilizing laser sintering

The present invention provides a method of manufacturing a porous chemical mechanical polishing pad. The method comprises retracting a retractable surface to form a sintering chamber and dispensing thermoplastic particles into the sintering chamber via a dispenser. The method further provides focusi...

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Bibliographic Details
Main Author SAIKIN ALAN H
Format Patent
LanguageEnglish
Published 11.10.2007
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:The present invention provides a method of manufacturing a porous chemical mechanical polishing pad. The method comprises retracting a retractable surface to form a sintering chamber and dispensing thermoplastic particles into the sintering chamber via a dispenser. The method further provides focusing a laser beam from a laser onto the thermoplastic particles and selectively sintering the thermoplastic particles with the laser beam.
Bibliography:Application Number: US20060400401