Method of Packaging Electronic Component

• Main Authors: SAKAI TADAHIKO, WADA YOSHIYUKI
• Format: Patent
• Language: English
• Published: 27.09.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method of packaging an electronic component, which is capable of enhancing electrical and mechanical bonding reliability of the electronic component. Terminal ( 4 ) is provided on the side face of electronic component ( 1 ). Electrode ( 6 ) is formed on one or the other major surface of substrate ( 5 ) and terminal ( 4 ) provided in electronic component ( 1 ) is located on electrode ( 6 ). Solder paste produced by mixing solder particles with thermosetting flux is applied to electrode ( 6 ), terminal ( 4 ) of electronic component ( 1 ) is mounted on and brought into contact with the applied solder paste, and electronic component ( 1 ) is mounted on substrate ( 5 ) with clearance (S) provided between a part of electronic component ( 1 ) and opposing substrate ( 5 ). Solder bonding structure ( 8 ) for coupling terminal ( 4 ) and electrode ( 6 ) is formed by reflow. Solder bonding structure ( 8 ) includes solder bonding portion ( 8 a), resin reinforcing portion ( 8 b) and resin adhering portion ( 8 c). Resin reinforcing portion ( 8 b) reinforces solder bonding portion ( 8 a), and resin adhering portion ( 8 c) fixes electronic component ( 1 ) to substrate ( 5 ) when the resin entering clearance (S) between electronic component ( 1 ) and substrate ( 5 ) is solidified.