PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS USING THE PHOTOSENSITIVE RESIN COMPOSITION

A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic...

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Bibliographic Details
Main Authors YAMAZAKI NORIYUKI, KAWASAKI DAI, SASAKI NORI, FUJIEDA NAGATOSHI
Format Patent
LanguageEnglish
Published 20.09.2007
Subjects
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