PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS USING THE PHOTOSENSITIVE RESIN COMPOSITION

A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic...

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Bibliographic Details
Main Authors YAMAZAKI NORIYUKI, KAWASAKI DAI, SASAKI NORI, FUJIEDA NAGATOSHI
Format Patent
LanguageEnglish
Published 20.09.2007
Subjects
AUXILIARY PROCESSES IN PHOTOGRAPHY
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES
PHOTOGRAPHY
PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES
PHYSICS
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Summary:A photosensitive resin composition includes (a) a polymer mainly composed of a repeating unit represented by the following general formula (I); (b) a dissolution accelerator for a developing solution; and (c) a solvent: wherein R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic group, R is a monovalent organic group having a carbon-carbon unsaturated double bond or a group represented by O-M+ (M+ represents a hydrogen ion or a cation composed of hydrogen and a compound having the carbon-carbon unsaturated double bond) in which the compound having the carbon-carbon unsaturated double bond is ionically bonded, at least one carbon-carbon unsaturated double bond is contained in all repeating units, m is an integer of 2 or more, and n is 1 or 2.
Bibliography:Application Number: US20070688610