Micromechanical Device And Method For Manufacturing A Micromechanical Device

In a method for manufacturing a micromechanical device having a region for forming an integrated circuit, at first a first layer is produced on a deeper-lying part in the substrate. Subsequently, a membrane layer is produced on the first layer and at least one channel completely penetrating the memb...

Full description

Saved in:
Bibliographic Details
Main Authors WINKLER BERNHARD, MUELLER KARLHEINZ
Format Patent
LanguageEnglish
Published 09.08.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:In a method for manufacturing a micromechanical device having a region for forming an integrated circuit, at first a first layer is produced on a deeper-lying part in the substrate. Subsequently, a membrane layer is produced on the first layer and at least one channel completely penetrating the membrane layer is introduced in the membrane layer. After that, a region of the first layer below the membrane layer is removed to form a cavity. Finally, the channel is sealed and a planar surface is formed.
Bibliography:Application Number: US20070668743