CMP Porous Pad with Component-Filled Pores

This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.

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Bibliographic Details
Main Author PRASAD ABANESHWAR
Format Patent
LanguageEnglish
Published 09.08.2007
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GRINDING
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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More Information
Summary:This invention provides a method for polishing pad comprising a polymeric material having pores and a component that is disposed within the pores.
Bibliography:Application Number: US20070690944