Method for manufacturing mold type semiconductor device

A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller...

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Bibliographic Details
Main Authors HIRANO NAOHIKO, SAKAMOTO YOSHITSUGU, MIURA SHOJI, KATO NOBUYUKI, NIIMI AKIHIRO, TESHIMA TAKANORI
Format Patent
LanguageEnglish
Published 12.07.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
Bibliography:Application Number: US20070702498