Method for electroplating metal wire
A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate an...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
14.06.2007
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Subjects | |
Online Access | Get full text |
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Summary: | A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD). |
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Bibliography: | Application Number: US20070625269 |