Integrated circuit and method for manufacturing

A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.

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Bibliographic Details
Main Authors DODD SIMON, BRYANT FRANK R, MCMAHON TERRY E, WANG S. J, HINDMAN GREGORY T, MILLER RICHARD T, TOM DENNIS W
Format Patent
LanguageEnglish
Published 01.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor structure, fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate is formed from a conductive layer.
Bibliography:Application Number: US20060540321