Wafer heating apparatus and method of setting the apparatus

A wafer apparatus including a heating plate, a case supporting and containing the heating plate, pressing arms laid across the case and the heating plate, and arm controlling units vertically moving the pressing arm toward the case. A plurality of the pressing arms and the arm controlling units are...

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Bibliographic Details
Main Authors LEE DONG W, KIM TAE G, LEE JIN S
Format Patent
LanguageEnglish
Published 01.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:A wafer apparatus including a heating plate, a case supporting and containing the heating plate, pressing arms laid across the case and the heating plate, and arm controlling units vertically moving the pressing arm toward the case. A plurality of the pressing arms and the arm controlling units are disposed along the circumference of the heating plate and may compensate a portion protruded upward due to the warpage of the heating plate by pressurizing. The warpage of the heating plate can be effectively compensated, and a wafer can be heated with a uniform temperature.
Bibliography:Application Number: US20060483879