Semiconductor Wafer with a Wiring Structure, a Semiconductor Component, and Methods for Their Production
A semiconductor wafer is provided with a wiring structure, and semiconductor chip positions arranged in rows and columns. The semiconductor wafer has at least one coating ( 6 ) as a self-supporting dimensionally stable substrate layer ( 4 ), and/or as a wiring structure composed of conductive, high-...
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Main Author | |
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Format | Patent |
Language | English |
Published |
01.02.2007
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Subjects | |
Online Access | Get full text |
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