Semiconductor Wafer with a Wiring Structure, a Semiconductor Component, and Methods for Their Production

• Main Author: STRACK HELMUT
• Format: Patent
• Language: English
• Published: 01.02.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

A semiconductor wafer is provided with a wiring structure, and semiconductor chip positions arranged in rows and columns. The semiconductor wafer has at least one coating ( 6 ) as a self-supporting dimensionally stable substrate layer ( 4 ), and/or as a wiring structure composed of conductive, high-temperature-resistant material. The coating material ( 6 ) of the substrate layer ( 4 ) and/or of the wiring structure has a ternary carbide and/or a ternary nitride and/or carbon.