MULTILAYERED STRUCTURE FORMING METHOD

A multilayered structure forming method includes disposing a dummy post on a first insulating pattern as a first inkjet process, disposing a second insulating pattern on the first insulating pattern as a second inkjet process so as to allow the second insulating pattern to surround a side surface of...

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Bibliographic Details
Main Authors WADA KENJI, SHINTATE TSUYOSHI
Format Patent
LanguageEnglish
Published 28.12.2006
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COLOUR PRINTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINING MACHINES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A multilayered structure forming method includes disposing a dummy post on a first insulating pattern as a first inkjet process, disposing a second insulating pattern on the first insulating pattern as a second inkjet process so as to allow the second insulating pattern to surround a side surface of the dummy post, and disposing a first conductive pattern on the second insulating pattern a third inkjet process so as to connect the first conductive pattern to the dummy post. In this method, the first inkjet process includes a process for ejecting a functional liquid containing a first conductive material having high adhesiveness to the first conductive pattern onto the first insulating pattern.
Bibliography:Application Number: US20060425762