Method of providing cured coating films free of popping defects
A method for providing cured coating films free of popping defects. The method requires the application to a substrate of at least 2.0 mils/50.8 microns of a uncured curable coating composition comprising an anti-popping component (a), a film-forming component (b), and a crosslinking component (c),...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
16.11.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A method for providing cured coating films free of popping defects. The method requires the application to a substrate of at least 2.0 mils/50.8 microns of a uncured curable coating composition comprising an anti-popping component (a), a film-forming component (b), and a crosslinking component (c), wherein anti-popping component (a) has from 12 to 72 carbon atoms, is substantially free of any heteroatoms, is not a crystalline solid at room temperature and comprises a mixture of two or more structures selected from the group consisting of aliphatic structures for anti-popping component (a), aromatic-containing structures for anti-popping component (a), cycloaliphatic-containing structures for anti-popping component (a), and mixtures thereof, at least one of the two or more structures being a cycloaliphatic-containing structure or an aromatic-containing structure. The coated uncured substrate is cured to provide a cured film free of popping defects with an average film build of at least 2.0 mils/50.8 microns. |
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Bibliography: | Application Number: US20020261888 |