Stencil and method for depositing material onto a substrate

A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.

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Bibliographic Details
Main Author WATSON JEFFREY R
Format Patent
LanguageEnglish
Published 09.11.2006
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
Bibliography:Application Number: US20060485052