Polishing technique to minimize abrasive removal of material and composition therefor

The present invention provides a composition and a method of polishing a surface that minimizes abrasive removal of material from the surface. To that end, the composition is formulated to maximize dissolution of the material from the surface.

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Bibliographic Details
Main Authors GROSCHOPF JOHANNES, FARKAS JANOS, COOPER JENNIFER, COOPER KEVIN E, FLAKE JOHN C, SOLOMENTSEV YURI
Format Patent
LanguageEnglish
Published 05.10.2006
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
TRANSPORTING
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Summary:The present invention provides a composition and a method of polishing a surface that minimizes abrasive removal of material from the surface. To that end, the composition is formulated to maximize dissolution of the material from the surface.
Bibliography:Application Number: US20050093578