Stacked die in die BGA package

Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

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Bibliographic Details
Main Authors LIM THIAM C, NEO CHEE P, TAN MICHAEL K.S, TAN VICTOR C.K, TAN HOCK C, CHEW BENG C, POUR CHENG P
Format Patent
LanguageEnglish
Published 28.09.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
Bibliography:Application Number: US20060440913