METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVICES IN COMPRESSIVELY LOADED ENVIRONMENTS

An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are pro...

Full description

Saved in:
Bibliographic Details
Main Authors COICO PATRICK A, FASANO BENJAMIN V, ZUCCO PAUL A, GOLDMANN LEWIS S, TOY HILTON T, EDWARDS DAVID L, INGALLS ELLYN M, JUNE MICHAEL S
Format Patent
LanguageEnglish
Published 14.09.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An integrated circuit chip mounting structure includes a chip carrier electrically connected to a circuit board with an integrated circuit chip mounted on the chip carrier. In addition, a thermally conductive device is thermally connected to the chip and a set of compressible support members are provided to transmit a portion of an applied compressive load from the thermally conductive device to the chip and chip carrier.
Bibliography:Application Number: US20050906809