Method for efficient annealing of plated semiconductor package leads

• Main Authors: ZUNIGA-ORTIZ EDGAR R, KODURI SREENIVASAN K
• Format: Patent
• Language: English
• Published: 24.08.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for completing an assembled semiconductor device, which has metallic leads for connection to external parts. The method comprises the step ( 202 ) of encapsulating the assembled device with a polymeric precursor so that at least portions of the leads remain un-encapsulated. Without significant delay, these un-encapsulated lead portions are plated ( 203 ) with at least one metal layer suitable for connection to external parts; the plating step has no noticeable impact on the uncured mold compound. The encapsulated and plated device is then submitted ( 204 ) to a sequence of elevated temperatures for specified periods of time so that concurrently the precursor is polymerized and the at least one metal layer is annealed.