Method for efficient annealing of plated semiconductor package leads

A method for completing an assembled semiconductor device, which has metallic leads for connection to external parts. The method comprises the step ( 202 ) of encapsulating the assembled device with a polymeric precursor so that at least portions of the leads remain un-encapsulated. Without signific...

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Bibliographic Details
Main Authors ZUNIGA-ORTIZ EDGAR R, KODURI SREENIVASAN K
Format Patent
LanguageEnglish
Published 24.08.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for completing an assembled semiconductor device, which has metallic leads for connection to external parts. The method comprises the step ( 202 ) of encapsulating the assembled device with a polymeric precursor so that at least portions of the leads remain un-encapsulated. Without significant delay, these un-encapsulated lead portions are plated ( 203 ) with at least one metal layer suitable for connection to external parts; the plating step has no noticeable impact on the uncured mold compound. The encapsulated and plated device is then submitted ( 204 ) to a sequence of elevated temperatures for specified periods of time so that concurrently the precursor is polymerized and the at least one metal layer is annealed.
Bibliography:Application Number: US20050065689