Semiconductor device having directly attached heat spreader

• Main Authors: WRIGHT LANCE C, ZUNIGA-ORTIZ EDGAR R, SAYE RICHARD J
• Format: Patent
• Language: English
• Published: 03.08.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An apparatus consisting of a leadframe ( 301 ) and a metallic heat spreader ( 310 ). The leadframe, made of a planar metal sheet, includes a plurality of non-coplanar members ( 312 ) operable as mechanical couplers configured to grip inserted objects. The heat spreader has a central pad ( 310 ) suitable for mounting a heat-generating object, and a plurality of handles ( 312 ) in locations to match the members; the handles are coupled with the members. One member end is formed as a clamp having projections from the planar sheet, operable to grip one of the handles, when it is inserted into the coupler, and also has a bend so that the plane of the heat spreader, after insertion of its handles into the clamps, is spaced from the plane of the leadframe. A gap is thus created between the spreader and the first leadframe segment ends.