Systems and methods for spinning semiconductor wafers
Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
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Main Author | |
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Format | Patent |
Language | English |
Published |
20.07.2006
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Subjects | |
Online Access | Get full text |
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Summary: | Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer. |
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Bibliography: | Application Number: US20050038509 |