Systems and methods for spinning semiconductor wafers

Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.

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Bibliographic Details
Main Author PHAM XUYEN N
Format Patent
LanguageEnglish
Published 20.07.2006
Subjects
CLEANING
CLEANING IN GENERAL
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
TRANSPORTING
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Summary:Systems and methods are disclosed to process first and second sides of a wafer. The system includes a platform adapted to receive and rotate said wafer; and first and second heads coupled to the platform to access said first and second sides of said wafer.
Bibliography:Application Number: US20050038509