Multi-zone shower head for drying single semiconductor substrate
A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each process...
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Main Author | |
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Format | Patent |
Language | English |
Published |
13.07.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each processing zone. |
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Bibliography: | Application Number: US20050032852 |