Multi-zone shower head for drying single semiconductor substrate

A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each process...

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Bibliographic Details
Main Author PHAM XUYEN N
Format Patent
LanguageEnglish
Published 13.07.2006
Subjects
BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
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Summary:A shower head processes a wafer with a plate having a plurality of nozzles positioned thereon, each of the nozzles assigned to one of a plurality of processing zones for the wafer; and a manifold assembly coupled to each of the nozzles to control one or more of the nozzles as a group in each processing zone.
Bibliography:Application Number: US20050032852