Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device
A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pa...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
15.06.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pattern is to be formed; imparting liquid affinity to a demarcated region which has been demarcated by the resin material; narrowing down the demarcated region by flowing out the resin material towards and into the demarcated region; and forming the partition wall by curing the resin material. |
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Bibliography: | Application Number: US20050235634 |