Solid electrolytic capacitor with face-down terminals, manufacturing method of the same, and lead frame for use therein

A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame ar...

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Bibliographic Details
Main Author ISHIJIMA MASAMI
Format Patent
LanguageEnglish
Published 15.06.2006
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Summary:A face-down terminal solid electrolytic capacitor with the increased strength between electrode terminals and a casing resin is provided. The face-down terminal solid electrolytic capacitor has a structure where a mold structure in which a lead frame and capacitor elements fixed to the lead frame are overmolded with a casing resin is cut along cutting planes respectively passing through an anode terminal forming portion and a cathode terminal forming portion of the lead frame so that end surfaces of an anode terminal and a cathode terminal are exposed. In the lead frame, the anode terminal forming portion 21 and the cathode terminal forming portion 22 are provided so as to face each other. The anode terminal forming portion has a concave portion 21 j on the board mount side and a convex portion 21 t on the opposite side, which are formed by deforming part of the anode terminal forming portion in a direction perpendicular to a board mount surface. The concave portion is applied with plating. The convex portion has a flat portion parallel to the board mount surface and serving as a welding margin, an inclined portion 21 b continuous with the flat portion and inclined so as to approach the board mount surface as going away from the flat portion, and projecting portions 21 a on lateral sides of the convex portion. By cutting along a cutting plane 23 a, the anode terminal is formed so as to have a cut end surface, a fillet surface 24 a, and a board mount surface as exposed surfaces.
Bibliography:Application Number: US20050274400